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Microelectronics Manufacturing Engineering ME

Course Description

See the Department website - http://www.rit.edu/kgcoe/program/microelectronic-engineering-1

The master of engineering in microelectronics manufacturing engineering provides a broad-based education for students who are interested in a career in the semiconductor industry and hold a bachelor’s degree in traditional engineering or other science disciplines.

Program outcomes

After completing the program, students will be able to:

- Design and understand a sequence of processing steps to fabricate a solid state device to meet a set of geometric, electrical, and/or processing parameters.

- Analyze experimental electrical data from a solid state device to extract performance parameters for comparison to modeling parameters used in the device design.

- Understand current lithographic materials, processes, and systems to meet imaging and/or device patterning requirements.

- Understand the relevance of a process or device, either proposed or existing, to current manufacturing practices.

- Perform in a microelectronic engineering environment, as evidenced by an internship.

- Appreciate the areas of specialty in the field of microelectronics, such as device engineering, circuit design, lithography, materials and processes, and yield and manufacturing.

Plan of study

This 30 credit hour program is awarded upon the successful completion of six core courses, two elective courses, a research methods course, and an internship. Under certain circumstances, a student may be required to complete bridge courses totaling more than the minimum number of credits. Students complete courses in microelectronics, microlithography, and manufacturing.


The microelectronics courses cover major aspects of integrated circuit manufacturing technology, such as oxidation, diffusion, ion implantation, chemical vapor deposition, metalization, plasma etching, etc. These courses emphasize modeling and simulation techniques as well as hands-on laboratory verification of these processes. Students use special software tools for these processes. In the laboratory, students design and fabricate silicon MOS integrated circuits, learn how to utilize semiconductor processing equipment, develop and create a process, and manufacture and test their own integrated circuits.


The microlithography courses are advanced courses in the chemistry, physics, and processing involved in microlithography. Optical lithography will be studied through diffraction, Fourier, and image-assessment techniques. Scalar diffraction models will be utilized to simulate aerial image formation and influences of imaging parameters. Positive and negative resist systems as well as processes for IC application will be studied. Advanced topics will include chemically amplified resists; multiple-layer resist systems; phase-shift masks; and electron beam, X-ray, and deep UV lithography. Laboratory exercises include projection-system design, resist-materials characterization, process optimization, and electron-beam lithography.


The manufacturing courses include topics such as scheduling, work-in-progress tracking, costing, inventory control, capital budgeting, productivity measures, and personnel management. Concepts of quality and statistical process control are introduced. The laboratory for this course is a student-run factory functioning within the department. Important issues such as measurement of yield, defect density, wafer mapping, control charts, and other manufacturing measurement tools are examined in lectures and through laboratory work. Computer-integrated manufacturing also is studied in detail. Process modeling, simulation, direct control, computer networking, database systems, linking application programs, facility monitoring, expert systems applications for diagnosis and training, and robotics are supported by laboratory experiences in the integrated circuit factory. The program is also offered online for engineers employed in the semiconductor industry.


The program requires students to complete an internship. This requirement provides a structured and supervised work experience that enables students to gain job-related skills that assist them in achieving their desired career goals.

Students with prior engineering-related job experience may submit a request for internship waiver with the program director. A letter from the appropriate authority substantiating the student’s job responsibility, duration, and performance quality would be required.

For students who are not working in the semiconductor industry while enrolled in this program, the internship may be completed at RIT. It involves an investigation or study of a subject or process directly related to microelectronic engineering under the supervision of a faculty adviser. An internship may be taken any time after the completion of the first semester, and may be designed in a number of ways. At the conclusion of the internship, submission of a final internship report to the faculty adviser and program director is required.

Visit the Microelectronics Manufacturing Engineering ME page on the Rochester Institute of Technology USA website for more details!

Entry Requirements

Hold a baccalaureate degree from an accredited university in engineering or a related field, Submit official transcripts (in English) from all previously completed undergraduate and graduate course work, Have an GPA of 3.0 or higher, Submit two letters of reference from individuals well qualified to judge the candidate's ability for graduate study, and Complete a graduate application. International applicants whose native language is not English must submit scores from the Test of English as a Foreign Language (TOEFL) or from the International English Language Testing System (IELTS).

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